Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction
14 de ene. de 2020 ·
55m 51s
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Descripción
Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction Greg and Tony talk to me about stencil design and how to reduce voiding....
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Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction
Greg and Tony talk to me about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper entitled "Root Cause Stencil Design for SMT Component Thermal Lands"
Download here: https://tinyurl.com/szx3xt8
Greg Smith can be reached here: gsmith@blueringstencils.com
Tony Lentz can be reached here: tlentz@fctassembly.com
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Greg and Tony talk to me about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper entitled "Root Cause Stencil Design for SMT Component Thermal Lands"
Download here: https://tinyurl.com/szx3xt8
Greg Smith can be reached here: gsmith@blueringstencils.com
Tony Lentz can be reached here: tlentz@fctassembly.com
Información
| Autor | Reliability Matters |
| Organización | Reliability Matters |
| Página web | - |
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