Episode 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
24 de nov. de 2020 ·
50m 9s
Descarga y escucha en cualquier lugar
Descarga tus episodios favoritos y disfrútalos, ¡dondequiera que estés! Regístrate o inicia sesión ahora para acceder a la escucha sin conexión.
Descripción
Episode 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts Voiding is the cause of multiple failure mechanisms. I spoke with solder material expert Tim O'Neill...
mostra más
Episode 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
Voiding is the cause of multiple failure mechanisms. I spoke with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.
My guests may be reached here:
Tim O'Neill
Aim Solder
toneill@aimsolder.com
www.aimsolder.com
Prakash Gango
StenTech
prakash@stentech.com
www.stentech.com
Kalyan Nukala
Kalyan.Nukala@zestronusa.com
www.zestron.com
mostra menos
Voiding is the cause of multiple failure mechanisms. I spoke with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.
My guests may be reached here:
Tim O'Neill
Aim Solder
toneill@aimsolder.com
www.aimsolder.com
Prakash Gango
StenTech
prakash@stentech.com
www.stentech.com
Kalyan Nukala
Kalyan.Nukala@zestronusa.com
www.zestron.com
Información
| Autor | Reliability Matters |
| Organización | Reliability Matters |
| Página web | - |
| Etiquetas |
Copyright 2024 - Spreaker Inc. an iHeartMedia Company
