IBM and SAP Drive Innovation: Unleashing Generative AI Solutions and Expanding Chiplet Technology with Rapidus

5 de jun. de 2024 · 6m 8s

Descripción

IBM and SAP are enhancing business and industry value through new generative AI solutions. Additionally, Rapidus is expanding its collaboration with IBM to develop chiplet packaging technology for 2nm-generation semiconductors.

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Información

Autor	Spod Media LLC
Página web	-
Etiquetas	#2nm-generation #ai solutions #ai technology #business technology #business value #chip technology #chiplet packaging #collaboration #cutting-edge technology #enterprise solutions #generative ai #ibm #industry value #packaging technology #rapidus #sap #semiconductor technology #semiconductors #technology innovation #technology partnership