Transcrito
TSMC Insights: 3D Chip Packaging, 2nm Facility Progress, and Moore's Law Debate
29 de jul. de 2024 ·
7m 32s
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TSMC Insights: 3D Chip Packaging, 2nm Facility Progress, and Moore's Law Debate
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Descripción
TSMC exec emphasizes that the viability of Moore's Law is secondary to continued technology scaling, highlighting the role of 3D chip packaging in driving advancements. Despite Typhoon Gaemi, the most...
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TSMC exec emphasizes that the viability of Moore's Law is secondary to continued technology scaling, highlighting the role of 3D chip packaging in driving advancements. Despite Typhoon Gaemi, the most powerful typhoon to hit Taiwan in eight years, construction of TSMC's 2nm facility in Kaohsiung remains on schedule.
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